PAYMENT DETAILS

  • Order Details
    1
  • Confirm
    2

Order Details

Are you one of the authors of this manuscript?
No. of Copies
 
(minmum 25 copies)

Billing and Shipping Addresses

Billing Address

Payer Name
Email
Phone
Address
City
Country
Tax/Customs info
(e.g. 'CPF/CNPJ', 'RUT','EORI', or 'NPWP')

Shipping Address

Attention of
Email
Phone
Address
(P.O. Box is not allowed)
City
Country

Note: if you do not confirm your information in step 2, your information will not be saved.

List of Authors

  • Jinhua Mi
  • Yuan-Jian Yang
  • Weiwen Peng
  • Hong-Zhong Huang

Article Details

Journal Title
The Scientific World Journal
Volume
2014
Article Title
Thermal Cycling Life Prediction of Sn-3.0Ag-0.5Cu Solder Joint Using Type-I Censored Data
List of Authors
  • Jinhua Mi
  • Yuan-Jian Yang
  • Weiwen Peng(ORCID ID: http://orcid.org/0000-0001-9535-9187)
  • Hong-Zhong Huang
Article ID
807693
Article Type
Research Article
No. of Pages
11 Pages
Corresponding Author
Yan-Feng Li
Additional Authors

Invoice Details

Invoice Issue Date
23 April 2024
Type of Reprints
Colored, Covered
Invoice Ref. No.
Terms
Payable upon Receipt

Charges

No. of Copies
Reprints Charges
0.00
Total
$