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Article Details

Journal Title
International Journal of Antennas and Propagation
Volume
2015
Article Title
Modeling and Electromagnetic Analysis of Multilayer Through Silicon Via Interconnect for 3D Integration
List of Authors
  • Ting Kang
  • Wei Zhang
  • Jianwei Wang
Article ID
470952
Article Type
Research Article
No. of Pages
14 Pages
Corresponding Author
Zhaowen Yan
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Invoice Issue Date
29 April 2024
Type of Reprints
Colored, Covered
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