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Article Details
- Journal Title
- ElectroComponent Science and Technology
- Volume
- 11
- Article Title
- Solid State Metal-Ceramic Reaction Bonding Applications to Transistor Packages and Advanced Materials
- List of Authors
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- R. V. Allen
- Article ID
- 361625
- Article Type
- Short Communication
- No. of Pages
- 3 Pages
- Corresponding Author
- Additional Authors
Invoice Details
- Invoice Issue Date
- 6 May 2024
- Type of Reprints
- Colored, Covered
- Invoice Ref. No.
- Terms
- Payable upon Receipt
Charges
- No. of Copies
- Reprints Charges
- 0.00
- Total
- $